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NX TMG Electronics Systems Cooling

NX TMG Electronic Systems Cooling for Advanced Simulation environment is an industry-specific vertical application that leverages the NX Flow and NX Thermal solvers as well as the PCB.xchange and other high tech and electronics industry-specific cooling capabilities in a bundle product. It provides a comprehensive set of tools to simulate 3D air flow and thermo-fluid behaviour in high tech and electronic systems.

Aplicaciones de NX Electronic Systems Cooling

 NX Electronic Systems Cooling helps resolve thermal engineering challenges early in the design process and is a valuable aid in understanding the physics of fluid flow and heat transfer for electronic enclosures and cooling applications.

 Some practical applications

  • Determining electronic systems cooling strategies
  • Enclosure, subsystem and power supply thermal management
  • Detailed thermal design of PC boards and multi-chip modules
  • Thermally sensitive and critical components placement
  • Heat sinks modeling
  • Spacing requirements between critical parts
  • Predicting fan operating conditions
  • Volume and mass flow estimations
  • Computing pressure inlet/outlet gradients and head losses
  • Identifying recirculation areas and hot spot issues
  • NX Electronic Systems Cooling has an interface with EDA design systems for direct and bi-directional PCB and FPC data exchanges. All of the leading PCB and FPC layout software packages are supported:
    • Zuken
    • Mentor Graphics
    • Cadence
    • VeriBest
    • OrCAD
    • Incases
    • Comtel

 Main NX Electronic System Cooling features:

  • Specific capabilities for electronics simulation applications
    • Heat sink models library and heat sink modeler
    • Electronic thermal component library
    • Fan catalogue (database of fan curves) with more than 2000 fans from leading manufacturers
    • PCB modeler/xchange (ECAD/MCAD bi-directional data exchange)
  • NX Electronic Systems Cooling general simulation capabilities
    • Steady-state and transient analysis (adaptive correction multigrid solver)
    • Turbulent (k-εe, mixing length), laminar and mixed flows
    • Internal or external flows
    • Automatic skin mesh (boundary layer mesh) with unlimited layer options
    • Complete set of automatic and/or manual meshing options for the selected fluid domains
    • Unstructured fluid meshes (supports any combination of tetrahedral, brick, pyramid and wedge elements-linear and parbolic types)
    • Multiple 1st and 2nd order advection with or without flux limiters
    • Efficient time stepping and other algorithms for fast transient calculations
    • Solution intermediate results recovery allowing solver restart
    • Heat loads and temperature restraints on the fluid domain
    • Forced, natural and mixed convection
    • Fluid buoyancy
    • Multiple enclosures
    • Multiple fluids
    • Losses in fluid flow due to screens, filters and other fluid obstructions (including orthotropic porous blockages)
    • Head loss inlets and openings (fixed or proportional to calculated velocity or squared velocity)
    • Fluid swirl at inlet and internal fans
    • Fluid recirculation loop with head loss, heat loss, heat input/loss or fluid temperature change between unconnected fluid regions
    • Automatic connection between disjoint fluid meshes
    • Altitude effects
    • Nonlinear flow boundary conditions
    • Nonlinear thermal contacts
    • Thermal couplings (welded, bolted, bonded, and other thermal contacts) for assembly modeling
    • Disjoint thermal/fluid meshes support in assembly modeling
    • Surface-to-surface radiative heat transfer
    • Thermal solution customization (user subroutine)
    • Hemicube-based view factor calculation (using graphics card hardware)
    • Radiation enclosures
    • Radiative sources
    • Diurnal solar environmental heating (including cloud, altitude, longitude and latitude effects, pollution and other solar attenuation effects)
    • Specular and transmissive surfaces
    • Hydraulic fluid networks
    • Joule heating
    • Heater and thermostat modeling
    • Peltier cooler modeling

Catálogo de NX Electronic Systems Cooling

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