NX
TMG Thermal
for
Advanced Simulation environment solves engineering heat transfer problems
within the most complex NX assemblies.
NX
TMG Thermal
combines the versatility of FEbased modeling with the accuracy of a
finitedifference solver. The high order finite volume simulations offer fast
and high fidelity numerical predictions of radiation, conduction and convection
heat transfer problems. NX TMG Thermal can also be coupled seamlessly to NX
Flow,
the NX CFD solution, for coupled thermofluid simulation.
NX
Thermal Couplings
provide a powerful and efficient capability for modeling heat flow between
unconnected parts and components.
Multiple
"whatif" scenarios and positioning of parts within an assembly can be
investigated by defining thermal coupling parameters between unconnected parts
once. Thermal coupling types include conductive, radiative, convective and
interface couplings.
Thermal
couplings can be defined as varying within model parameters, such as temperature
or heat load. All heat paths between unconnected parts are created at runtime
automatically.
NX
Thermal solver capabilities:
 Steadystate
and transient (linear and nonlinear).
 Fully
coupled conduction, radiation and convection heat transfer simulation.
 Iterative
conjugate gradient solver technology.
 Efficient
time stepping and other advanced transient algorithms.
 Diffuse
view (form) factor calculations with shadowing.
 Hemicubebased
view factor calculation (using graphics card hardware).
 Material
nonlinear thermal properties.
 Axissymmetric
modeling.
 Cyclic
thermal problems.
Thermal
Couplings technology for modeling thermal contacts within NX assemblies:
 Thermally
connect disjoint and dissimilar mesh faces and edges.
 Surfacetosurface,
edgetoedge or edgetosurface contact modeling between parts: constant,
time or temperaturedependent coefficient of heat transfer, resistance or
conductance.
 Radiative
exchange between disjoint part faces (or faces within a single part).
 Interface
modeling between connected parts: constant, time or temperaturedependent
coefficient of heat transfer, resistance or conductance.
Applied
heat loads:
 Constant
and timedependent:
 Heat
loads.
 Heat
flux.
 Heat
generation.
 All
applied loads can be controlled with temperaturecontrolled thermostat
conditions.
Temperature
boundary conditions:
 Constant
temperature for steadystate or transient.
 Time
varying for transient and for nonlinear steadystate.
 Thermostat
temperature controls.
Conduction
heat transfer:
 Handles
large conduction models (memory efficient data scheme).
 Temperaturedependent
conductivity, specific heat.
 Orthotropic
conductivity.
 Heat
of formation at phase change temperature.
Convection
heat transfer:
 Constant,
time and temperaturedependent heat transfer coefficients
 Parameter
and nonlinear temperature gradient functions
Radiation
heat transfer:
 Constant
and temperaturedependent emissivity.
 Multiple
radiation enclosures.
 Diffuse
view (form) factor calculations with shadowing.
 Net
view (form) factor calculations.
 Adaptive
scheme for view (form) factor sum optimization.
 Hemicubebased
view (form) factors calculation using graphics card hardware.
 Radiation
patch generation to condense large elementbased radiation models.
 Radiation
matrix controls and parameters.
Initial
conditions:
 Starting
temperatures for both steadystate and transient runs.
 Starting
temperatures from previous solution results, or from file.
Solver
solution attributes
 Restart
conditions
 Cyclic
convergence criteria
 Direct
access to solver parameters
 Solver
convergence criteria and relaxation factors
 Solver
monitor with solution convergence and attributes
 Intermediate
results display and recovery directly from solver progress monitor
NX
results postprocessing
 Temperature.
 Temperature
gradient.
 Total
load and flux.
 Conductive
flux.
 Convective
flux.
 Convection
coefficient.
 Residual.
 View
factor sum.
NX
Thermal specific postprocessing features
 Results
Reporter.
 Summary
of results to Excel worksheets.
 Heat
flow calculation between groups.
 Heat
maps.
 Complete
or partial deactivation of selected elements (for radiation form factors
calculations).
 Temperature
mapping for Nastran and other FE models.
SÍGUENOS
EN:
